Chiplink

Chiplink is a physical layer interconnect fabric that allows for high-speed communication between multiple integrated circuits (ICs). It is based on the TileLink protocol, which is a scalable and flexible interconnect fabric for manycore processors.

Chiplink is designed to be a low-latency, high-bandwidth interconnect fabric that can be used to connect a variety of different types of ICs, including CPUs, GPUs, FPGAs, and memory controllers. It can also be used to connect different types of packages, such as chip-on-board (COB) and chip-on-package (COP).

Chiplink is implemented using a variety of different physical layer technologies, including copper, optical, and millimeter wave. This allows Chiplink to be used in a wide range of applications, from high-performance computing to mobile devices.

Here are some of the benefits of using Chiplink:

  • High bandwidth and low latency: Chiplink can support high-speed communication between ICs, with bandwidths of up to 100 Tbps and latencies of less than 1 ns.
  • Scalability and flexibility: Chiplink is a scalable and flexible interconnect fabric that can be used to connect a variety of different types of ICs and packages.
  • Low power consumption: Chiplink is designed to be a low-power interconnect fabric, making it ideal for use in mobile devices and other battery-powered devices.

Chiplink is still under development, but it has the potential to revolutionize the way that ICs are interconnected. It could enable the development of new types of electronic devices with higher performance, lower power consumption, and smaller size.

Contact Us Today

If you are looking for a reliable and knowledgeable Chiplink supplier, contact Vistar Technovation today. We are here to help you succeed with your Chiplink projects.

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